QIANLI MEGA-IDEA Black BGA Reballing Stencil 0.3–0.5mm Mesh

Product Features:

• Universal BGA Reballing Stencil – Designed for precise tin planting and soldering of various BGA chip sizes with mesh hole diameters of 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
• Durable Steel Construction – Made of high-quality blackened steel, offering excellent heat resistance, durability, and long-term usability.
• Precision Laser-Cut Design – Provides accurate alignment and clean ball placement for professional-level chip repair and soldering work.
• Multifunctional Use – Compatible with a wide range of chips and IC components—perfect for smartphone, motherboard, and electronics repair.
• Compact & Reusable – Lightweight, easy to store, and can be used repeatedly with proper care.

Specifications:

• Brand: QIANLI MEGA-IDEA
• Type: Hand Tool Parts / BGA Reballing Stencil
• Mesh Sizes: 0.3mm, 0.35mm, 0.4mm, 0.5mm (varies by selection)
• Material: High-strength blackened steel mesh
• Use: Soldering / reballing IC chips
• Origin: Mainland China
• Chemical Concern: None
• Customization: Not customizable

What’s Included:

• 1 × BGA Reballing Stencil (choose mesh size)

The QIANLI MEGA-IDEA BGA Reballing Stencil is a must-have for precision electronics repair. With multiple mesh size options and durable blackened steel construction, it's ideal for technicians working on chip-level soldering and reballing tasks. Compact, reusable, and engineered for accuracy—this tool delivers reliable results every time.